Integrated fan-out package

ABSTRACT

An integrated fan-out (InFO) package includes a plurality of dies, an encapsulant, an insulating layer, a redistribution structure, a plurality of conductive structures, an antenna confinement structure, and a slot antenna. The encapsulant laterally encapsulates the dies. The insulating layer is disposed over the dies and the encapsulant. The redistribution structure is sandwiched between the insulating layer and the dies. The conductive structures and the antenna confinement structure are embedded in the insulating layer. The slot antenna is disposed on the insulating layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation application of and claims thepriority benefit of a prior application Ser. No. 16/198,857, filed onNov. 22, 2018. The prior application Ser. No. 16/198,857 claims thepriority benefits of U.S. provisional application Ser. No. 62/737,880,filed on Sep. 27, 2018. The entirety of the above-mentioned patentapplication is hereby incorporated by reference herein and made a partof this specification.

BACKGROUND

Semiconductor devices and integrated circuits used in a variety ofelectronic apparatus, such as cell phones and other mobile electronicequipment, are typically manufactured on a single semiconductor wafer.The dies of the wafer may be processed and packaged with othersemiconductor devices (e.g. antenna) or dies at the wafer level, andvarious technologies have been developed for the wafer level packaging.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a schematic top view illustrating an integrated fan-out (InFO)package in accordance with some embodiments of the disclosure.

FIG. 2 is a schematic perspective view of a region in the InFO packagein FIG. 1 in accordance with some embodiments of the disclosure.

FIG. 3A to FIG. 3N are schematic cross-sectional views illustrating amanufacturing process of the region in FIG. 2 along line B-B′.

FIG. 4 is a schematic cross-sectional view of the region in FIG. 2 alongline A-A′.

FIG. 5A is a schematic perspective view of a region in the InFO packagein FIG. 1 in accordance with some alternative embodiments of thedisclosure.

FIG. 5B is a schematic cross-sectional view of the region in FIG. 5Aalong line A-A′.

FIG. 6 is a schematic perspective view of a region in the InFO packagein FIG. 1 in accordance with some alternative embodiments of thedisclosure.

FIG. 7A to FIG. 7J are schematic cross-sectional views illustrating amanufacturing process of the region in FIG. 6 along line B-B′.

FIG. 8 is a schematic cross-sectional view of the region in FIG. 6 alongline A-A′.

FIG. 9A is a schematic perspective view of a region in the InFO packagein FIG. 1 in accordance with some alternative embodiments of thedisclosure.

FIG. 9B is a schematic cross-sectional view of the region in FIG. 9Aalong line A-A′.

FIG. 10 is a schematic top view of a region in the InFO package in FIG.1 in accordance with some embodiments of the disclosure.

FIG. 11A to FIG. 11J are schematic cross-sectional views illustrating amanufacturing process of the region in FIG. 10 along line A-A′.

FIG. 12 is a schematic top view illustrating an InFO package inaccordance with some alternative embodiments of the disclosure.

FIG. 13A to FIG. 13G are schematic cross-sectional views illustrating amanufacturing process of the InFO package in FIG. 12 along line A-A′.

FIG. 14A to FIG. 14G are schematic cross-sectional views illustrating amanufacturing process of the InFO package in FIG. 12 along line B-B′.

FIG. 15 is a schematic top view illustrating an InFO package inaccordance with some alternative embodiments of the disclosure.

FIG. 16A to FIG. 16I are schematic cross-sectional views illustrating amanufacturing process of the InFO package in FIG. 15 along line A-A′.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Other features and processes may also be included. For example, testingstructures may be included to aid in the verification testing of the 3Dpackaging or 3DIC devices. The testing structures may include, forexample, test pads formed in a redistribution layer or on a substratethat allows the testing of the 3D packaging or 3DIC, the use of probesand/or probe cards, and the like. The verification testing may beperformed on intermediate structures as well as the final structure.Additionally, the structures and methods disclosed herein may be used inconjunction with testing methodologies that incorporate intermediateverification of known good dies to increase the yield and decreasecosts.

FIG. 1 is a schematic top view illustrating an integrated fan-out (InFO)package 10 in accordance with some embodiments of the disclosure. FIG. 2is a schematic perspective view of a region R in the InFO package 10 inFIG. 1 in accordance with some embodiments of the disclosure. Referringto FIG. 1 and FIG. 2, the InFO package 10 includes a redistributionstructure 100, a plurality of dies 300, a plurality of first conductivestructures 200 (shown in FIG. 3N), an encapsulant 404, a redistributionstructure 500, an insulating layer 404, a plurality of second conductivestructures 602, an antenna confinement structure 604, a slot antenna700, and a plurality of conductive terminals 900. In some embodiments,the dies 300 and the first conductive structures 200 are disposed on theredistribution structure 100, and the first conductive structures 200surround the dies 300. The encapsulant 402 encapsulates the dies 300 andthe first conductive structures 200. The redistribution structure 500 isdisposed on the die 300, the first conductive structures 200, and theencapsulant 402. The insulating layer 404 is disposed over theredistribution structure 500. The second conductive structures 602 andthe antenna structure 604 are embedded in the insulating layer 404. Theslot antenna 700 is disposed on the insulating layer 404. The conductiveterminals 900 are disposed on the redistribution structure 100. In someembodiments, the slot antenna 700 has a plurality of slots SL. Therelative configurations of these elements and the manufacturing processof the InFO package 10 will be discussed in detail below in conjunctionwith FIG. 3A to FIG. 3N and FIG. 4.

FIG. 3A to FIG. 3N are schematic cross-sectional views illustrating amanufacturing process of the region R in FIG. 2 along line B-B′. FIG. 4is a schematic cross-sectional view of the region R in FIG. 2 along lineA-A′. Referring to FIG. 3A, a carrier C1 having a de-bonding layer DBformed thereon is provided. In some embodiments, the carrier C1 is aglass substrate. However, other suitable materials may be adapted as amaterial of the carrier C1 as long as the material is able to withstandthe subsequent processes while carrying the package structure formedthereon. In some embodiments, the de-bonding layer DB is a light-to-heatconversion (LTHC) release layer formed on the glass substrate. Thede-bonding layer DB may allow the structure formed on the carrier C1 inthe subsequent processes to be peeled off from the carrier C1.

Referring to FIG. 3B, a redistribution structure 100 and a plurality offirst conductive structures 200 are formed over the de-bonding layer DB.In some embodiments, the redistribution structure 100 includes aplurality of dielectric layers 102 and a plurality of redistributioncircuit patterns 104 stacked alternately. In some embodiments, theredistribution structure 100 further includes a plurality of conductivevias 106 embedded in the dielectric layers 102. In some embodiments, theredistribution circuit patterns 104 are interconnected with one anotherthrough the conductive vias 106.

The method of forming the redistribution structure 100 may include thefollowing steps. First, the bottommost dielectric layer 102 may beformed on the de-bonding layer DB. In some embodiments, a material ofthe dielectric layer 102 includes polyimide, epoxy resin, acrylic resin,phenol resin, benzocyclobutene (BCB), polybenzooxazole (PBO), or anyother suitable polymer-based dielectric material. The dielectric layer102, for example, may be formed by suitable fabrication techniques suchas spin-on coating, chemical vapor deposition (CVD), plasma-enhancedchemical vapor deposition (PECVD), or the like. Thereafter, a seedmaterial layer (not shown) is blanketly formed over the bottommostdielectric layer 102. In some embodiments, the seed material layerincludes a titanium/copper composite layer and is formed by a sputteringprocess. Then, a mask pattern (not shown) having openings is formed onthe seed material layer. The openings of the mask pattern expose theintended location for the subsequently formed redistribution circuitpatterns 104. Afterwards, a plating process is performed to form aconductive material layer on the seed material layer exposed by theopenings of the mask pattern. In some embodiments, a material of theconductive material layer includes aluminum, titanium, copper, nickel,tungsten, and/or alloys thereof. The mask pattern and the underlyingseed material layer are then removed by a stripping process and anetching process. The remaining seed material layer and the remainingconductive material layer then constitute the bottommost redistributioncircuit patterns 104. After forming the bottommost dielectric layer 102and the bottommost redistribution circuit patterns 104, anotherdielectric layer 102 may be formed over the bottommost dielectric layer102 and the bottommost redistribution circuit patterns 104.Subsequently, a plurality of contact openings may be formed in suchdielectric layer 102 to expose the bottommost redistribution circuitpatterns 104. Then, the step of forming the seed material layer and theconductive material layer presented above may be repeated to render theredistribution circuit patterns 104 and the conductive vias 106 locatedabove the bottommost redistribution circuit patterns 104. The foregoingstep then may be repeated several times to obtain the redistributionstructure 100 having multiple layers.

It should be noted that although two layers of the redistributioncircuit patterns 104 and three layers of the dielectric layers 102 areillustrated in FIG. 3B, the number of these layers is not limited inthis disclosure. In some alternative embodiments, the redistributionstructure 100 may be constituted by more or less layers of thedielectric layer 102 and the redistribution circuit patterns 104depending on the circuit design.

The first conductive structures 200 are formed over the redistributionstructure 100. In some embodiments, the first conductive structures 200are electrically connected to the redistribution structure 100. In someembodiments, the first conductive structures 200 may be formedsimultaneously with the topmost conductive vias 106 during the samestage. For example, the topmost dielectric layer 102 of theredistribution structure 100 may be patterned to form a plurality ofcontact openings exposing at least a portion of the topmostredistribution circuit patterns 104. Subsequently, a seed material layer(not shown) is formed over the topmost dielectric layer 102 and over thetopmost redistribution circuit pattern 104 exposed by the contactopenings. In some embodiments, the seed material layer includes atitanium/copper composite layer and is formed by a sputtering process.Thereafter, a mask pattern (not shown) with openings is formed on theseed material layer. The openings of the mask pattern expose theintended locations for the subsequently formed first conductivestructures 200. Afterwards, a plating process is performed to form ametal material layer (e.g., a copper layer) on the seed material layerexposed by the openings of the mask pattern. The mask pattern and theunderlying seed material layer are then removed to form the firstconductive structures 200 and the topmost conductive vias 106. However,the disclosure is not limited thereto. In some alternative embodiments,other suitable methods may be utilized to form the first conductivestructures 200 and the topmost conductive vias 106. For example,pre-fabricated first conductive structures 200 may be picked and placedonto the redistribution structure 100 such that the first conductivestructures 200 and the topmost conductive vias 106 are formedseparately.

Referring to FIG. 3C, a die 300 is picked and placed onto theredistribution structure 100. The die 300 is placed such that the firstconductive structures 200 surround the die 300. In some embodiments, thedie 300 includes a semiconductor substrate 310, a plurality ofconductive posts 312, and a protection layer 314. The semiconductorsubstrate 310 may be a silicon substrate including active components(e.g., transistors or the like) and passive components (e.g., resistors,capacitors, inductors, or the like) formed therein. In some embodiments,the die 300 may further include a plurality of conductive pads (notshown) and a passivation layer (not shown). The conductive pads arelocated on the semiconductor substrate 310. The passivation layer maypartially cover the conductive pads. The conductive pads may be aluminumpads, copper pads, or other suitable metal pads. The passivation layermay be a silicon oxide layer, a silicon nitride layer, a siliconoxy-nitride layer, or a dielectric layer formed by other suitabledielectric materials. The conducive posts 312 may be formed on theexposed conductive pads such that the conductive posts 312 areelectrically connected to the conductive pads. In some embodiments, theconductive posts 312 are made of conductive materials and are plated onthe conductive pads. For example, a material of conductive posts 312 mayinclude copper, copper alloys, or the like. The protection layer 314covers the conductive posts 312. For example, the conductive posts 312may be well protected and not revealed by the protection layer 314. Insome embodiments, the protection layer 314 may be formed by dielectricmaterials. For example, the protection layer 314 may be a polyimidelayer, a PBO layer, or a dielectric layer formed by other suitablepolymers.

In some embodiments, the die 300 is attached (or adhered) on theredistribution structure 100 through an adhesive layer AD. In someembodiments, the adhesive layer AD may include a die attach film (DAF)or other materials having adhesion property. Although FIG. 3B and FIG.3C illustrated that the first conductive structures 200 are formed priorto the placement of the die 300, the disclosure is not limited thereto.In some alternative embodiments, the die 300 may be placed before thefirst conductive structures 200 are formed on the redistributionstructure 100.

Referring to FIG. 3D, an encapsulation material 402′ is formed over theredistribution structure 100 to encapsulate the first conductivestructures 200 and the die 300. For example, the first conductivestructures 200 and the protection layer 314 of the die 300 areencapsulated by the encapsulation material 402′. In other words, thefirst conductive structures 200 and the protection layer 314 of the die300 are not revealed and are well protected by the encapsulationmaterial 402′. In some embodiments, the encapsulation material 402′ is amolding compound, a molding underfill, a resin (such as epoxy), or thelike. In some embodiments, the encapsulation material 402′ may includefillers. In some embodiments, the encapsulation material 402′ may beformed by a molding process. For example, the encapsulation material402′ may be formed by a compression molding process.

Referring to FIG. 3D and FIG. 3E, the encapsulation material 402′ andthe protection layer 314 of the die 300 are grinded until top surfaces312 a of the conductive posts 312 and top surfaces 200 a of the firstconductive structure 200 are exposed. After the encapsulation material402′ is grinded, an encapsulant 402 is formed over the redistributionstructure 100 to encapsulate the first conductive structures 200 and thedie 300. In some embodiments, the encapsulation material 402′ is grindedby a mechanical grinding process and/or a chemical mechanical polishing(CMP) process. In some embodiments, during the grinding process of theencapsulation material 402′, the protection layer 314 is grinded toreveal the conductive posts 312. In some embodiments, portions of theconductive posts 312 and portions of the first conductive structures 200are slightly grinded as well. After grinding, the die 300 has an activesurface 300 a and a rear surface 300 b opposite to the active surface300 a. The exposed portion of the conductive posts 312 is located on theactive surface 300 a of the die 300. The encapsulant 402 encapsulatessidewalls of the die 300. In some embodiments, the encapsulant 402 ispenetrated by the first conductive structures 200. In other words, thedie 300 and the first conductive structures 200 are embedded in theencapsulant 402. In some embodiments, the top surfaces 200 a of thefirst conductive structures 200 and the top surfaces 312 a of theconductive posts 312 are substantially coplanar with a top surface 402 aof the encapsulant 402. It is noted that since the redistributionstructure 100 is located on the rear surface 300 b of the die 300, theredistribution structure 100 may be referred to as a backsideredistribution structure.

Referring to FIG. 3F, a redistribution structure 500, a plurality ofsecond conductive structures 602, and an antenna confinement structure604 are formed on the first conductive structures 200, the die 300, andthe encapsulant 402. The redistribution structure 500 is disposed on theactive surface 300 a of the die 300. In some embodiments, theredistribution structure 500 is electrically connected to the conductiveposts 312 of the die 300 and the first conductive structures 200. It isnoted that since the redistribution structure 500 is located on theactive surface 300 a of the die 300, the redistribution structure 500may be referred to as a front-side redistribution structure. In someembodiments, the redistribution structure 500 includes a plurality ofdielectric layers 502, a plurality of redistribution circuit patterns504, a ground plane GP, and a plurality of conductive vias 506. In someembodiments, the dielectric layers 502 and the redistribution circuitpatterns 504 are stacked alternately. On the other hand, the conductivevias 506 are embedded in the dielectric layer 502. In some embodiments,the redistribution circuit patterns 504 are interconnected with oneanother through the conductive vias 506. In some embodiments, the groundplane GP is sandwiched between two adjacent dielectric layers 502. Thatis, the ground plane GP may be considered as being embedded in thedielectric layers 502.

The method of forming the redistribution structure 500 may include thefollowing steps. First, the bottommost dielectric layer 502 may beformed on the first conductive structures 200, the die 300, and theencapsulant 402. In some embodiments, a material of the dielectric layer502 includes polyimide, epoxy resin, acrylic resin, phenol resin, BCB,PBO, or any other suitable polymer-based dielectric material. Thedielectric layer 502, for example, may be formed by suitable fabricationtechniques such as spin-on coating, CVD, PECVD, or the like. Thereafter,a plurality of contact openings may be formed in the bottommostdielectric layer 502. The contact openings at least partially exposeseach conductive post 312 of the die 300 and each first conductivestructure 200. Then, a seed material layer (not shown) is formed overthe bottommost dielectric layer 502 and in the contact openings. Theseed material layer extends into the contact openings to be in contactwith the conductive posts 312 and the first conductive structures 200.In some embodiments, the seed material layer includes a titanium/coppercomposite layer and is formed by a sputtering process. Then, a maskpattern (not shown) having openings is formed on the seed materiallayer. The openings of the mask pattern expose the intended location forthe subsequently formed redistribution circuit patterns 504 and groundplane GP. For example, the openings of the mask pattern may expose theseed material layer located inside of the contact openings and the seedmaterial layer in proximity of the contact openings. Afterwards, aplating process is performed to form a conductive material layer on theseed material layer exposed by the openings of the mask pattern. In someembodiments, a material of the conductive material layer includesaluminum, titanium, copper, nickel, tungsten, and/or alloys thereof. Themask pattern and the underlying seed material layer are then removed bya stripping process and an etching process. The remaining seed materiallayer and the remaining conductive material layer then constitute thebottommost conductive vias 506, the bottommost redistribution circuitpatterns 504, and the ground plane GP. In other words, the ground planeGP and the redistribution circuit patterns 504 may be formed by a samephotolithography and etching process at the same time. The foregoingstep may be repeated several times to obtain the redistributionstructure 500 having multiple layers.

In some embodiments, the ground plane GP is electrically connected to aground. On the other hand, at least some of the redistribution circuitpatterns 504 may be electrically connected to other subsequently formedconductive elements for signal transmission. In some embodiments, theseredistribution circuit patterns 504 may be electrically connected to theconductive posts 312 of the die 300 to constitute a portion of a feedline.

It should be noted that although one layer of the redistribution circuitpatterns 504 and two layers of the dielectric layers 502 are illustratedin FIG. 3F, the number of these layers is not limited in thisdisclosure. In some alternative embodiments, the redistributionstructure 500 may be constituted by more layers of the dielectric layer502 and the redistribution circuit patterns 504 depending on the circuitdesign.

The second conductive structures 602 and the antenna confinementstructure 604 are formed over the redistribution structure 500. In someembodiments, the second conductive structures 602 are electricallyconnected to the redistribution structure 500. In some embodiments, thesecond conductive structures 602 and the antenna confinement structure604 may be formed at the same time during the same step. In someembodiments, the second conductive structures 602 and the antennaconfinement structure 604 may be formed simultaneously with the topmostconductive vias 506 during the same stage. In some embodiments, themethod of forming the second conductive structures 602 and the antennaconfinement structure 604 may be similar to that of the first conductivestructures 200, so the detailed descriptions thereof are omitted herein.In some embodiments, the second conductive structures 602 and theantenna confinement structure 604 are made of copper, copper alloys, orthe like.

Referring to FIG. 3G, an insulating material 404′ is formed over theredistribution structure 500 to encapsulate the second conductivestructures 602 and the antenna confinement structure 604. In otherwords, the second conductive structures 602 and the antenna confinementstructure 604 are not revealed and are well protected by the insulatingmaterial 404′. In some embodiments, a material of the insulatingmaterial 404′ has a low dissipation factor (DO and/or a low permittivity(Dk). Depending on the frequency range of high-speed applications,suitable insulating material 404′ may be selected based on the requiredelectrical properties of the subsequently formed InFO package 10. Forexample, the insulating material 404′ may include polymer, epoxy, thelike, or a combination thereof. The insulating material 404′ is formedby a suitable fabrication technique, such as spin-coating, lamination,deposition, molding, or the like. For example, as illustrated in FIG.3G, the insulating material 404′ is formed on the redistributionstructure 500 through an over-molding process.

Referring to FIG. 3G and FIG. 3H, the insulating material 404′ isplanarized until top surfaces 602 a of the second conductive structures602 and a top surface 604 a of the antenna confinement structure 604 areexposed. After the insulating material 404′ is planarized, an insulatinglayer 404 is formed over the redistribution structure 500 to encapsulatethe second conductive structures 602 and the antenna confinementstructure 604. That is, the second conductive structures 602 and theantenna confinement structure 604 are embedded in the insulating layer404. In some embodiments, the second conductive structures 602 and theantenna confinement structure 604 penetrate through the insulating layer404.

In some embodiments, the insulating material 404′ is planarized througha grinding process. The grinding process includes, for example, amechanical grinding process and/or a chemical mechanical polishing (CMP)process. In some alternative embodiments, the insulating material 404′may be planarized through a fly cutting process. In some embodiments,during the planarization process of the insulating material 404′,portions of the second conductive structures 602 and portions of theantenna confinement structure 604 are slightly grinded as well. In someembodiments, after the planarization process, the second conductivestructures 602 and the antenna confinement structure 604 havesubstantially the same height. For example, a height H602 of the secondconductive structures 602 and a height H604 of the antenna confinementstructure 604 may range between 30 μm and 50 μm. In some embodiments,the top surfaces 602 a of the second conductive structures 602 and thetop surface 604 a of the antenna confinement structure 604 aresubstantially coplanar with a top surface 404 a of the insulating layer404.

As mentioned above, the insulating layer 404 may adapt low Df and/or Dkmaterial for reducing the signal transmission loss. Therefore, in someembodiments, the material of the insulating layer 404 may be differentfrom the material of the dielectric layers 502 in the redistributionstructure 500. However, the disclosure is not limited thereto. In somealternative embodiments which will be discussed later, the material ofthe insulating layer 404 may be the same as the material of thedielectric layers 502 in the redistribution structure 500.

Referring to FIG. 3I, a slot antenna 700 is formed on the insulatinglayer 404, the second conductive structures 602, and the antennaconfinement structure 604. In some embodiments, the slot antenna 700 maybe electrically connected to the second conductive structures 602 andthe antenna confinement structure 604. In other words, the signalsoriginated from the die 300 may be transmitted to the slot antenna 700sequentially through the conductive vias 506, the redistribution circuitpatterns 504, and the second conductive structures 602. Therefore, theredistribution circuit patterns 504 connecting to the die 300 and thesecond conductive structures 602 may be collectively referred to as afeed line. In some embodiments, the slot antenna 700 may include aplurality of slots SL arranged in an array (shown in FIG. 1 and FIG. 2).In some embodiments, the slot antenna 700 may be formed by a conductivematerial. For example, the material of the slot antenna 700 may includealuminum, titanium, copper, nickel, tungsten, and/or alloys thereof. Insome embodiments, the slot antenna 700 is formed by the following steps.First, a metallization layer (not shown) is formed over the insulatinglayer 404 through electroplating or deposition. Then, the metallizationlayer is patterned by photolithography and etching processes to renderthe slot antenna 700 having the slots SL.

Referring to FIG. 3J, a protection layer 800 is formed on the insulatinglayer 404 to cover the slot antenna 700. In other words, the slotantenna 700 is embedded in the protection layer 800. In someembodiments, the protection layer 800 may be selected from low Df and/orDk materials to ensure the signal transmission quality. For example, thematerial of the protection layer 800 may include polymer, epoxy, thelike, or a combination thereof. In some embodiments, the material of theprotection layer 800 may be identical to the insulating layer 404.However, the disclosure is not limited thereto. In some alternativeembodiments, the material of the protection layer 800 may be differentfrom the insulating layer 404. It is noted that the formation of theprotection layer 800 is optional. That is, in some alternativeembodiments, the step illustrated in FIG. 3J may be skipped in themanufacturing process of the InFO package 10.

Referring to FIG. 3J and FIG. 3K, the structure illustrated in FIG. 3Jis flipped upside down and is placed on a carrier C2. The de-bondinglayer DB and the carrier C1 are removed from the redistributionstructure 100. In some embodiments, the de-bonding layer DB (e.g., theLTHC release layer) may be irradiated by an UV laser such that thecarrier C1 and the de-bonding layer DB may be peeled off from thedielectric layer 102 of the redistribution structure 100. However, thede-bonding process is not limited thereto. Other suitable de-carriermethods may be used in some alternative embodiments.

Referring to FIG. 3L, a plurality of openings OP is formed in theoutermost dielectric layer 102 of the redistribution structure 100. Insome embodiments, the openings OP are formed by a laser drillingprocess, a mechanical drilling process, a photolithography process andan etching process, or other suitable processes. As illustrated in FIG.3L, the openings OP expose the outermost redistribution circuit patterns104 of the redistribution structure 100.

Referring to FIG. 3M, a plurality of conductive terminals 900 is formedover the redistribution structure 100 opposite to the die 300. In someembodiments, the conductive terminals 900 extend into the openings OP toelectrically connect with the outermost redistribution circuit pattern104. In some embodiments, a plurality of under bump metallization (UBM)patterns (not shown) may be formed on the outermost dielectric layer 102and in the openings OP. The conductive terminals 900 may be disposedover the UBM patterns. In some embodiments, the conductive terminals 900are attached to the UBM patterns through a solder flux. In someembodiments, the conductive terminals 900 are, for example, solderballs. In some embodiments, the conductive terminals 900 may be disposedon the redistribution structure 100 through a ball placement processand/or a reflowing process.

Referring to FIG. 3M and FIG. 3N, the structure illustrated in FIG. 3Mis flipped upside down and the carrier C2 is removed. At this stage, themanufacturing process of the InFO package 10 is substantially completed.It is noted that other regions of the InFO package 10 shown in FIG. 1may be manufactured by adapting similar processes as that of the regionR, so the detailed descriptions thereof are omitted herein. AlthoughFIG. 3N illustrated that the die 300 faces upward to be electricallyconnected with the redistribution structure 500, the disclosure is notlimited thereto. In some alternative embodiments, the die 300 may bearranged to face downward. Under this scenario, the die 300 iselectrically connected to the redistribution structure 100. In otherwords, the signals originated from the die 300 may be transmitted to theslot antenna 700 through the redistribution circuit patterns 104 of theredistribution structure 100, the conductive vias 106 of theredistribution structure 100, the first conductive structures 100, theconductive vias 506 of the redistribution structure 500, theredistribution circuit patterns 504 of the redistribution structure 500,and the second conductive structures 602.

As illustrated in FIG. 3N, the slot antenna 700 is being integrated atthe package level rather than the chip level. As such, ultra-large sizearray configuration for terahertz (THz) operation (for example, at afrequency range of 0.3 to 3 THz) may be realized. Moreover, a narrowerradiation beam width may be achieved, which is advantageous for beamsteering. Furthermore, the issue in which the signal radiation isabsorbed by the silicon substrate of the chip seen in chip levelintegration may be sufficiently resolved, thereby reducing the signalloss and enhancing the device performance.

Referring to FIG. 1, FIG. 2, and FIG. 4, the antenna confinementstructure 604 is shown as a ring structure surrounding the secondconductive structure 602. In other words, the antenna confinementstructure 604 may be a continuous structure forming an enclosuretogether with the slot antenna 700 and the redistribution structure 500.The enclosure may be a resonant cavity which is able to sufficientlyenhance the signal gain of the slot antenna 700. As such, the deviceperformance of the InFO package 10 may be enhanced.

FIG. 5A is a schematic perspective view of a region R in the InFOpackage 10 in FIG. 1 in accordance with some alternative embodiments ofthe disclosure. FIG. 5B is a schematic cross-sectional view of theregion R in FIG. 5A along line A-A′. Referring to FIG. 5A and FIG. 5B,the region R of the InFO package 10 illustrated in FIG. 5A and FIG. 5Bis similar to the region R of the InFO package 10 illustrated in FIG. 2and FIG. 4, so the detailed descriptions thereof are omitted herein. Thedifference between the region R of the InFO package 10 in FIG. 5A andFIG. 5B and the region R of the InFO package 10 in FIG. 2 and FIG. 4lies in that in FIG. 5A and FIG. 5B, the antenna confinement structure604 includes a plurality of antenna confinement patterns separate fromeach other. As illustrated in FIG. 5A and FIG. 5B, the antennaconfinement patterns are arranged in a discrete manner to surround thesecond conductive structures 602. In some embodiments, a shape of theantenna confinement patterns may be similar to a shape of the secondconductive structures 602. For example, each of the antenna confinementpatterns may took the form of a post or a pillar. Similar to thecontinuous ring pattern of FIG. 2, the discrete antenna confinementstructure 604 in FIG. 5A and FIG. 5B is able to provide a resonantcavity underneath the slot antenna 700, thereby enhancing the deviceperformance of the InFO package 10.

FIG. 6 is a schematic perspective view of a region R in the InFO package10 in FIG. 1 in accordance with some alternative embodiments of thedisclosure. Referring to FIG. 6, the manufacturing process of the regionR of the InFO package 10 illustrated in FIG. 6 will be described belowin conjunction with FIG. 7A to FIG. 7J and FIG. 8.

FIG. 7A to FIG. 7J are schematic cross-sectional views illustrating amanufacturing process of the region R in FIG. 6 along line B-B′. FIG. 8is a schematic cross-sectional view of the region R in FIG. 6 along lineA-A′. Referring to FIG. 7A to FIG. 7E, the steps illustrated in FIG. 7Ato FIG. 7E are similar to the steps shown in FIG. 3A to FIG. 3E, sosimilar elements are denoted by the same reference numeral and thedetailed descriptions thereof are omitted herein. Referring to FIG. 7F,a redistribution structure 500 is formed over the first conductivestructures 200, the die 300, and the encapsulant 402. The redistributionstructure 500 is disposed on the die 300 and is electrically connectedto the conductive posts 312 of the die 300 and the first conductivestructures 200. In some embodiments, the redistribution structure 500includes a dielectric layer 502, a plurality of redistribution circuitpatterns 504, a ground plane GP, and a plurality of conductive vias 506.In some embodiments, the redistribution circuit patterns 504 and theground plane GP are stacked on the dielectric layer 502. On the otherhand, the conductive vias 506 are embedded in the dielectric layer 502.In some embodiments, the redistribution circuit patterns 504 areinterconnected with one another through the conductive vias 506.

The method of forming the redistribution structure 500 may include thefollowing steps. First, the dielectric layer 502 may be formed on thefirst conductive structures 200, the die 300, and the encapsulant 402.In some embodiments, a material of the dielectric layer 502 includespolyimide, epoxy resin, acrylic resin, phenol resin, BCB, PBO, or anyother suitable polymer-based dielectric material. The dielectric layer502, for example, may be formed by suitable fabrication techniques, suchas spin-on coating, CVD, PECVD, or the like. Thereafter, a plurality ofcontact openings may be formed in the dielectric layer 502. The contactopenings at least partially exposes each conductive post 312 of the dieand each first conductive structure 200. Then, a seed material layer(not shown) is formed over the dielectric layer 502 and in the contactopenings. The seed material layer extends into the contact openings tobe in contact with the conductive posts 312 and the first conductivestructures 200. In some embodiments, the seed material layer includes atitanium/copper composite layer and is formed by a sputtering process.Then, a mask pattern (not shown) having openings is formed on the seedmaterial layer. The openings of the mask pattern expose the intendedlocation for the subsequently formed redistribution circuit patterns 504and ground plane GP. For example, the openings of the mask pattern mayexpose the seed material layer located inside of the contact openingsand the seed material layer in proximity of the contact openings.Afterwards, a plating process is performed to form a conductive materiallayer on the seed material layer exposed by the openings of the maskpattern. In some embodiments, a material of the conductive materiallayer includes aluminum, titanium, copper, nickel, tungsten, and/oralloys thereof. The mask pattern and the underlying seed material layerare then removed by a stripping process and an etching process. Theremaining seed material layer and the remaining conductive materiallayer then constitute the conductive vias 506, the redistributioncircuit patterns 504, and the ground plane GP. In other words, theground plane GP and the redistribution circuit patterns 504 may beformed by a same photolithography and etching process at the same time.

It should be noted that although one layer of the redistribution circuitpatterns 504 and one layer of the dielectric layers 502 are illustratedin FIG. 7F, the number of these layers is not limited in thisdisclosure. In some alternative embodiments, the foregoing formationmethod may be repeated several times to obtain the redistributionstructure 500 having more layers of the dielectric layer 502 and morelayers of the redistribution circuit patterns 504 depending on thecircuit design.

Referring to FIG. 7G, a plurality of second conductive structures 606,an antenna confinement structure 608, an insulating layer 406, adielectric layer 408, and a slot antenna 700 are formed over theredistribution structure 500. In some embodiments, the methods offorming the second conductive structures 606 and the antenna confinementstructure 608 may be similar to the method of forming the conductivevias 506. Similarly, the method of forming the slot antenna 700 issimilar to the method of forming the redistribution circuit patterns 504and the ground plane GP. Furthermore, the methods of forming theinsulating layer 406 and the dielectric layer 408 are similar to themethod of forming the dielectric layer 504. In other words, the secondconductive structures 606, the antenna confinement structure 608, theinsulating layer 406, the dielectric layer 408, and the slot antenna 700may be formed by the same method as that of the redistribution structure500 presented above. Therefore, from certain view points, the secondconductive structures 606, the antenna confinement structure 608, theinsulating layer 406, the dielectric layer 408, and the slot antenna 700may be considered as part of a redistribution structure.

In some embodiments, the second conductive structures 606 areelectrically connected to the redistribution structure 500. In someembodiments, the second conductive structures 606 and the antennaconfinement structure 608 may be formed at the same time during the samestep. In some embodiments, the second conductive structures 606 and theantenna confinement structure 608 may be considered as conductive vias.In some embodiments, the second conductive structures 606 and theantenna confinement structure 608 have substantially the same height.For example, a height H606 of the second conductive structures 606 and aheight H608 of the antenna confinement structure 608 may range between30 μm and 50 μm. In some embodiments, a ratio of a diameter to a heightof the second conductive structures 606 may be approximately 1:1.Similarly, a ratio of a diameter to a height of the antenna confinementstructure 608 may also be approximately 1:1. In some embodiments, thesecond conductive structures 606 and the antenna confinement structure608 may be made of materials similar to that of the conductive vias 506.For example, the material of the second conductive structures 606 andthe antenna confinement structure 608 includes aluminum, titanium,copper, nickel, tungsten, and/or alloys thereof. In some embodiments,the antenna confinement structure 608 may be electrically grounded.

In some embodiments, the slot antenna 700 is electrically connected tothe second conductive structures 606 and the antenna confinementstructure 608. In other words, the signals originated from the die 300may be transmitted to the slot antenna 700 sequentially through theconductive vias 506, the redistribution circuit patterns 504, and thesecond conductive structures 602. Therefore, the redistribution circuitpatterns 504 connecting to the die 300 and the second conductivestructures 606 may be collectively referred to as a feed line. In someembodiments, the slot antenna 700 may include a plurality of slots SLarranged in an array. In some embodiments, the slot antenna 700 may bemade of materials similar to that of the redistribution circuit patterns504. For example, the material of the slot antenna 700 includesaluminum, titanium, copper, nickel, tungsten, and/or alloys thereof.

As illustrated in FIG. 7G, the insulating layer 406 wraps around thesecond conductive structures 606 and the antenna confinement structure608. In some embodiments, the redistribution circuit patterns 504 arealso encapsulated by the insulating layer 406. In other words, theredistribution circuit patterns 504, the second conductive structures606, and the antenna confinement structure 608 are embedded in theinsulating layer 406. In some embodiments, the dielectric layer 408 isformed over the insulating layer 406 to cover the slot antenna 700. Insome embodiments, the insulating layer 406 and the dielectric layer 408may be made of materials similar to or the same as that of thedielectric layer 504 of the redistribution structure 500. For example,the material of the insulating layer 406 and the dielectric layer 408may include polyimide, epoxy resin, acrylic resin, phenol resin, BCB,PBO, or any other suitable polymer-based dielectric material.

Referring to FIG. 7H to FIG. 7J, the steps illustrated in FIG. 7H toFIG. 7J are similar to the steps shown in FIG. 3L to FIG. 3N, so similarelements are denoted by the same reference numeral and the detaileddescriptions thereof are omitted herein. At this stage, themanufacturing process of the InFO package 10 is substantially completed.It is noted that other regions of the InFO package 10 shown in FIG. 1may be manufactured by adapting similar processes as that of the regionR, so the detailed descriptions thereof are omitted herein. AlthoughFIG. 7J illustrated that the die 300 faces upward to be electricallyconnected with the redistribution structure 500, the disclosure is notlimited thereto. In some alternative embodiments, the die 300 may bearranged to face downward. Under this scenario, the die 300 iselectrically connected to the redistribution structure 100. In otherwords, the signals originated from the die 300 may be transmitted to theslot antenna 700 through the redistribution circuit patterns 104 of theredistribution structure 100, the conductive vias 106 of theredistribution structure 100, the first conductive structures 200, theconductive vias 506 of the redistribution structure 500, theredistribution circuit patterns 504 of the redistribution structure 500,and the second conductive structures 606.

Referring to FIG. 6 and FIG. 8, the antenna confinement structure 608 isshown to be a ring structure surrounding the second conductive structure606. In other words, the antenna confinement structure 608 may be acontinuous structure forming an enclosure together with the slot antenna700 and the redistribution structure 500. The enclosure may be aresonant cavity which is able to sufficiently enhance the signal gain ofthe slot antenna 700. As such, the device performance of the InFOpackage 10 may be enhanced.

FIG. 9A is a schematic perspective view of a region R in the InFOpackage 10 in FIG. 1 in accordance with some alternative embodiments ofthe disclosure. FIG. 9B is a schematic cross-sectional view of theregion R in FIG. 9A along line A-A′. Referring to FIG. 9A and FIG. 9B,the region R of the InFO package 10 illustrated in FIG. 9A and FIG. 9Bis similar to the region R of the InFO package 10 illustrated in FIG. 6and FIG. 8, so the detailed descriptions thereof are omitted herein. Thedifference between the region R of the InFO package 10 in FIG. 9A andFIG. 9B and the region R of the InFO package 10 in FIG. 6 and FIG. 8lies in that in FIG. 9A and FIG. 9B, the antenna confinement structure608 includes a plurality of antenna confinement patterns separate fromeach other. As illustrated in FIG. 9A and FIG. 9B, the antennaconfinement patterns are arranged in a discrete manner to surround thesecond conductive structures 606. In some embodiments, a shape of theantenna confinement patterns may be similar to a shape of the secondconductive structures 606. For example, each of the antenna confinementpatterns may took the form of a via. Similar to the continuous ringpattern of FIG. 6, the discrete antenna confinement structure 608 inFIG. 9A and FIG. 9B is able to provide a resonant cavity underneath theslot antenna 700, thereby enhancing the device performance of the InFOpackage 10.

FIG. 10 is a schematic top view of a region R in the InFO package 10 inFIG. 1 in accordance with some embodiments of the disclosure. Referringto FIG. 10, the manufacturing process of the region R of the InFOpackage 10 illustrated in FIG. 10 will be described below in conjunctionwith FIG. 11A to FIG. 11J.

FIG. 11A to FIG. 11J are schematic cross-sectional views illustrating amanufacturing process of the region R in FIG. 10 along line A-A′.Referring to FIG. 11A, a carrier C1 having a de-bonding layer DB1 formedthereon is provided. The carrier C1 and the de-bonding layer DB1 in FIG.11A may be similar to the carrier C1 and the de-bonding layer DB in FIG.3A, so the detailed descriptions thereof are omitted herein.Subsequently, an auxiliary insulating layer 1000 is formed on thede-bonding layer DB1. In some embodiments, the auxiliary insulatinglayer 1000 may be made of low Df and/or Dk materials. For example, theauxiliary insulating layer 1000 may include polymer or the like. In someembodiments, the auxiliary insulating layer 1000 is formed on thede-bonding layer DB1 through spin-coating, lamination, deposition, orthe like.

Referring to FIG. 11B, a plurality of first conductive patterns 1102 andan auxiliary insulating layer 1200 are sequentially formed on theauxiliary insulating layer 1000. In some embodiments, the firstconductive patterns 1102 are arranged in an array. For example, thefirst conductive patterns 1102 may be arranged periodically. In someembodiments, a material of the first conductive patterns 1102 mayinclude aluminum, titanium, copper, nickel, tungsten, and/or alloysthereof. In some embodiments, the first conductive patterns 1102 may beformed by the following steps. First, a metallization layer (not shown)is formed over the auxiliary insulating layer 1000 throughelectroplating or deposition. Subsequently, the metallization layer ispatterned by photolithography and etching processes to form the firstconductive patterns 1102. As illustrated in FIG. 11B, the auxiliaryinsulating layer 1200 is formed on the auxiliary insulating layer 1000to cover the first conductive patterns 1102. In other words, the firstconductive patterns 1102 are embedded in the auxiliary insulating layer1200. In some embodiments, a material of the auxiliary insulating layer1200 may be similar to the material of the auxiliary insulating layer1000. That is, the auxiliary insulating layer 1200 may be made of low Dfand/or Dk materials. For example, the auxiliary insulating layer 1200may include polymer, epoxy, the like, or a combination thereof.

Referring to FIG. 11C, a plurality of first conductive structures 200, aredistribution structure 500, a plurality of second conductivestructures 606, an antenna confinement structure 608, an insulatinglayer 406, a slot antenna 700, and a dielectric layer 408 are formedover the auxiliary insulating layer 1200. The first conductivestructures 200, the redistribution structure 500, the second conductivestructures 606, the antenna confinement structure 608, the insulatinglayer 406, the slot antenna 700, and the dielectric layer 408 in FIG.11C may be similar to the first conductive structures 200, theredistribution structure 500, the second conductive structures 606, theantenna confinement structure 608, the insulating layer 406, the slotantenna 700, and the dielectric layer 408 shown in FIG. 7G, so thedetailed descriptions thereof are omitted herein.

As illustrated in FIG. 11C, the dielectric layer 408 is formed on theauxiliary insulating layer 1200. In some embodiments, the dielectriclayer 408 is in direct contact with the auxiliary insulating layer 1200.The slot antenna 700 is disposed on the dielectric layer 408. Theinsulating layer 406 is formed over the slot antenna 700 and thedielectric layer 408. The second conductive structures 606 and theantenna confinement structure 608 are embedded in the insulating layer406. In some embodiments, the slot antenna 700 may be electricallyconnected to the second conductive structures 606 and the antennaconfinement structure 608. The redistribution structure 500 is formed onthe second conductive structures 606, the antenna confinement structure608, and the insulating layer 406. The redistribution structure 500includes a dielectric layer 502, a plurality of redistribution circuitpatterns 504, and a plurality of conductive vias 506. The redistributioncircuit patterns 504 are electrically connected to the second conductivestructures 606 and the antenna confinement structure 608. The firstconductive structures 200 are formed over the redistribution structure500. The first conductive structures 200 are electrically connected tothe redistribution structure 500. In some embodiments, the firstconductive structures 200 and the conductive vias 506 of theredistribution structure 500 may be simultaneously formed.

Referring to FIG. 11D to FIG. 11F, a die 300 and an encapsulant 402 areformed on the redistribution structure 500. The steps illustrated inFIG. 11D to FIG. 11F are similar to the steps shown in FIG. 7C to FIG.7E, so similar elements are denoted by the same reference numeral andthe detailed descriptions thereof are omitted herein.

Referring to FIG. 11G, a redistribution structure 100 is formed on thefirst conductive structures 200, the die 300, and the encapsulant 400.The redistribution structure 100 in FIG. 11G may be similar to theredistribution structure 100 in FIG. 7B, so the detailed descriptionsthereof are omitted herein. As illustrated in FIG. 11G, theredistribution structure 100 includes a plurality of dielectric layer102, a plurality of redistribution circuit patterns 104, and a pluralityof conductive vias 106. In some embodiments, the redistribution circuitpatterns 104 are electrically connected to the conductive pots 312 ofthe die 300 and the first conductive structures 100 through theconductive vias 106. In some embodiments, the redistribution structure100 or the redistribution structure 500 may further include a groundplane (not shown).

Referring to FIG. 11G and FIG. 11H, the structure illustrated in FIG.11G is flipped upside down and is attached to a carrier C2 and ade-bonding layer DB2. The carrier C1 and the de-bonding layer DB1 areremoved. In some embodiments, the de-bonding layer DB1 (e.g., the LTHCrelease layer) may be irradiated by an UV laser such that the carrier C1and the de-bonding layer DB1 may be peeled off from the auxiliaryinsulating layer 1000. However, the de-bonding process is not limitedthereto. Other suitable de-carrier methods may be used in somealternative embodiments. The carrier C2 and the de-bonding layer DB2 maybe similar to the carrier C1 and the de-bonding layer DB1, so thedetailed descriptions thereof are omitted herein. Thereafter, aplurality of second conductive patterns 1104 is formed on the auxiliaryinsulating layer 1000. In some embodiments, a material of the secondconductive patterns 1104 may include aluminum, titanium, copper, nickel,tungsten, and/or alloys thereof. In some embodiments, the secondconductive patterns 1104 may be formed by the following steps. First, ametallization layer (not shown) is formed over the auxiliary insulatinglayer 1000 through electroplating or deposition. Subsequently, themetallization layer is patterned by photolithography and etchingprocesses to form the second conductive patterns 1104. In someembodiments, the second conductive patterns 1104 are arranged in anarray. For example, as illustrated in FIG. 10 and FIG. 11H, the secondconductive patterns 1104 are arranged periodically. In some embodiments,a shape of the first conductive patterns 1102 may be identical to ashape of the second conductive patterns 1104. Moreover, a location ofthe first conductive patterns 1102 may correspond to a location of thesecond conductive patterns 1104. For example, a vertical projection ofthe second conductive patterns 1104 along a direction perpendicular tothe active surface 300 a of the die 300 may completely overlap with thefirst conductive patterns 1102. In some embodiments, the firstconductive patterns 1102 and the second conductive patterns 1104 mayserve as antennas. For example, the signal originated from the die 300may be sequentially transmitted to the slot antenna 700 through theredistribution structure 100, the first conductive structures 200, theredistribution structure 500, and the second conductive structures 606.The signal may then be electrically coupled to the first conductivepatterns 1102 and the second conductive patterns 1104 from the slotantenna 700. In some embodiments, due to the periodic arrangement of thefirst conductive patterns 1102 and the second conductive patterns 1104,the first conductive patterns 1102 and the second conductive patterns1104 may be collectively referred to as metamaterial lenses. That is,the properties of the elements around the first conductive patterns 1102and the second conductive patterns 1104 may be altered such that thesignal (in the form of energy) may be focused by the pairs of the firstconductive patterns 1102 and the second conductive patterns 1104. Byadapting the metamaterial lenses constituted by the first conductivepatterns 1102 and the second conductive patterns 1104, the signal gainmay be sufficiently increased and the device performance of the InFOpackage 10 may be effectively enhanced.

It should be noted that the shape of the second conductive patterns 1104shown in FIG. 10 merely serves as an exemplary illustration, and thedisclosure is not limited thereto. The first conductive patterns 1102and the second conductive patterns 1104 may exhibit other shapes fromthe top view as long as the first conductive patterns 1102 and thesecond conductive patterns 1104 are arranged periodically.

Referring to FIG. 11H and FIG. 11I, the structure illustrated in FIG.11H is flipped upside down again and is attached to a carrier C3 and ade-bonding layer DB3. The carrier C2 and the de-bonding layer DB2 areremoved. In some embodiments, the de-bonding layer DB2 (e.g., the LTHCrelease layer) may be irradiated by an UV laser such that the carrier C2and the de-bonding layer DB2 may be peeled off from the dielectric layer102 of the redistribution structure 100. However, the de-bonding processis not limited thereto. Other suitable de-carrier methods may be used insome alternative embodiments. The carrier C3 and the de-bonding layerDB3 may be similar to the carrier C1 and the de-bonding layer DB1, sothe detailed descriptions thereof are omitted herein. Thereafter, aplurality of openings OP is formed in the outermost dielectric layer 102of the redistribution structure 100. In some embodiments, the openingsOP are formed by a laser drilling process, a mechanical drillingprocess, a photolithography process and an etching process, or othersuitable processes. As illustrated in FIG. 11I, the openings OP exposethe outermost redistribution circuit patterns 104 of the redistributionstructure 100. Subsequently, a plurality of conductive terminals 900 isformed over the redistribution structure 100 opposite to the die 300. Insome embodiments, the conductive terminals 900 extend into the openingsOP to electrically connect with the outermost redistribution circuitpattern 104. In some embodiments, a plurality of UBM patterns (notshown) may be formed on the outermost dielectric layer 102 and in theopenings OP. The conductive terminals 900 may be disposed over the UBMpatterns. In some embodiments, the conductive terminals 900 are attachedto the UBM patterns through a solder flux. In some embodiments, theconductive terminals 900 are, for example, solder balls. In someembodiments, the conductive terminals 900 may be disposed on theredistribution structure 100 through a ball placement process and/or areflowing process.

Referring to FIG. 11I and FIG. 11J, the structure illustrated in FIG.11I is flipped upside down. The carrier C3 and the de-bonding layer DB3are removed. In some embodiments, the de-bonding layer DB3 (e.g., theLTHC release layer) may be irradiated by an UV laser such that thecarrier C3 and the de-bonding layer DB3 may be peeled off from thesecond conductive patterns 1104. However, the de-bonding process is notlimited thereto. Other suitable de-carrier methods may be used in somealternative embodiments. At this stage, the manufacturing process of theInFO package 10 is substantially completed. It is noted that otherregions of the InFO package 10 shown in FIG. 1 may be manufactured byadapting similar process as that of the region R, so the detaileddescriptions thereof are omitted herein. Although FIG. 11J illustratedthat the die 300 faces downward to be electrically connected with theredistribution structure 100, the disclosure is not limited thereto. Insome alternative embodiments, the die 300 may be arranged to faceupward. Under this scenario, the die 300 is electrically connected tothe redistribution structure 500.

FIG. 12 is a schematic top view illustrating an InFO package 20 inaccordance with some alternative embodiments of the disclosure.Referring to FIG. 12, the manufacturing process of the InFO package 20will be described below in conjunction with FIG. 13A to FIG. 13G andFIG. 14A to FIG. 14G.

FIG. 13A to FIG. 13G are schematic cross-sectional views illustrating amanufacturing process of the InFO package 20 in FIG. 12 along line A-A′.FIG. 14A to FIG. 14G are schematic cross-sectional views illustrating amanufacturing process of the InFO package 20 in FIG. 12 along line B-B′.Referring to FIG. 13A and FIG. 13B, a carrier C1 having a de-bondinglayer formed thereon is provided. The carrier C1 and the de-bondinglayer DB in FIG. 13A and FIG. 14A may be similar to the carrier C1 andthe de-bonding layer DB in FIG. 3A, so the detailed descriptions thereofis omitted herein.

Referring to FIG. 13B and FIG. 14B, a redistribution structure 100 and aplurality of conductive structures 202 are formed over the de-bondinglayer DB. The method of forming the redistribution structure 100 in FIG.13B and FIG. 14B may be similar to that of the redistribution structure100 in FIG. 3B, so the detailed descriptions thereof are omitted herein.In some embodiments, the redistribution structure 100 includes aplurality of dielectric layers 102, a plurality of first redistributioncircuit patterns 104 a, a plurality of second redistribution circuitpatterns 104 b, and a plurality of conductive vias 106. In someembodiments, the first redistribution circuit patterns 104 a and thesecond redistribution circuit patterns 104 b are sandwiched between twoadjacent dielectric layers 102. On the other hand, the conductive vias106 are embedded in the dielectric layer 102. In some embodiments, amaterial of the dielectric layer 102 includes polyimide, epoxy resin,acrylic resin, phenol resin, BCB, PBO, or any other suitablepolymer-based dielectric material. On the other hand, a material of thefirst redistribution circuit patterns 104 a, the second redistributioncircuit patterns 104 b, and the conductive vias 106 includes aluminum,titanium, copper, nickel, tungsten, and/or alloys thereof.

It should be noted that the number of layers of the dielectric layer 102and the second redistribution circuit patterns 104 b are not limited inthis disclosure. In some alternative embodiments, the redistributionstructure 100 may be constituted by more layers of the dielectric layer102 and the second redistribution circuit patterns 104 b than theillustration shown in FIG. 13B and FIG. 14B depending on the circuitdesign.

The conductive structures 202 are formed over the redistributionstructure 100. The conductive structures 202 in FIG. 13B and FIG. 14Bmay be similar to the first conductive structures 200 in FIG. 3B, so thedetailed descriptions thereof are omitted herein. In some embodiments,the conductive structures 202 are electrically connected to theredistribution structure 100.

Referring to FIG. 13C and FIG. 14C, a die 300 is picked and placed ontothe redistribution structure 100. The die 300 in FIG. 13C and FIG. 14Cmay be similar to the die 300 in FIG. 3C, so the detailed descriptionsthereof are omitted herein. In some embodiments, the die 300 is placedsuch that the conductive structures 202 are located on one side of thedie 300. In some embodiments, the die 300 is attached (or adhered) onthe redistribution structure 100 through an adhesive layer AD. In someembodiments, the adhesive layer AD may include a die attach film (DAF)or other materials having adhesion property.

Referring to FIG. 13D and FIG. 14D, an encapsulant 402 is formed overthe redistribution structure 100. The method of forming the encapsulant402 in FIG. 13D and FIG. 14D may be similar to that of the encapsulant402 in FIG. 3D and FIG. 3E, so the detailed descriptions thereof areomitted herein. In some embodiments, the encapsulant 402 encapsulatessidewalls of the conductive structures 202 and sidewalls of the die 300.In other words, the die 300 and the conductive structures 202 areembedded in the encapsulant 402. In some embodiments, the conductivestructures 202 penetrate through the encapsulant 402.

Referring to FIG. 13E and FIG. 14E, a redistribution structure 500 isformed on the conductive structures 202, the die 300, and theencapsulant 402. The method of forming the redistribution structure 500in FIG. 13E and FIG. 14E may be similar to that of the redistributionstructure 500 in FIG. 3F, so the detailed descriptions thereof areomitted herein. In some embodiments, the redistribution structure 500includes a plurality of dielectric layers 502, a plurality of firstredistribution circuit patterns 504 a, a plurality of secondredistribution circuit patterns 504 b, and a plurality of conductivevias 506. In some embodiments, the first redistribution circuit patterns504 a and the second redistribution circuit patterns 504 b aresandwiched between two adjacent dielectric layers 502. On the otherhand, the conductive vias 506 are embedded in the dielectric layer 502.In some embodiments, a material of the dielectric layer 502 includespolyimide, epoxy resin, acrylic resin, phenol resin, BCB, PBO, or anyother suitable polymer-based dielectric material. On the other hand, amaterial of the first redistribution circuit patterns 504 a, the secondredistribution circuit patterns 504 b, and the conductive vias 506includes aluminum, titanium, copper, nickel, tungsten, and/or alloysthereof. In some embodiments, the redistribution structure 100 or theredistribution structure 500 may further include a ground plane (notshown).

It should be noted that the number of layers of the dielectric layer 102and the second redistribution circuit patterns 504 b are not limited inthis disclosure. In some alternative embodiments, the redistributionstructure 500 may be constituted by more layers of the dielectric layer102 and the second redistribution circuit patterns 504 b than theillustration shown in FIG. 13E and FIG. 14E depending on the circuitdesign.

In some embodiments, the conductive structures 202 are electricallyconnected to the first redistribution circuit patterns 104 a and thefirst redistribution circuit patterns 504 a respectively through theconductive vias 106 and the conductive vias 506. For example, asillustrated in FIG. 13E, a pair of conductive structures 202 areconnected to a same first redistribution circuit pattern 104 a directlyunderneath the pair of conductive structures 202. Similarly, the pair ofconductive structures 202 are connected to a same second redistributioncircuit pattern 504 a directly above the pair of conductive structures202. In some embodiments, the pair of conductive structures 202 and thecorresponding first redistribution circuit patterns 104 a, 504 a areconnected to each other to form an enclosure, thereby constituting ahorn antenna 1300. In some embodiments, the first redistribution circuitpatterns 504 a may be referred to as a top wall of the horn antenna1300, the first redistribution circuit patterns 104 a may be referred toas a bottom wall of the horn antenna 1300, and the pair of conductivestructures 202 may be referred to as sidewalls of the horn antenna 1300.In other words, the top wall of the horn antenna 1300 is embedded in theredistribution structure 500, the bottom wall of the horn antenna 1300is embedded in the redistribution structure 100, and the sidewalls ofthe horn antenna 1300 penetrate through the encapsulant 402 to connectthe top wall and the bottom wall.

Referring to FIGS. 12, 13E, and 14E, the horn antenna 1300 is formedadjacent to the die 300. In some embodiments, the horn antenna 1300 aredisposed on one side of the die 300. However, the disclosure is notlimited thereto. In some alternative embodiments, the horn antenna 1300may be disposed on two sides, three sides, or all four sides of the die300. In some embodiments, the first redistribution circuit pattern 504 aextends over the active surface 300 a of the die to electrically connectthe horn antenna 1300 and the die 300. For example, the firstredistribution circuit patterns 504 a (top wall of the horn antenna1300) may extend over the active surface 300 a of the die 300 to beelectrically connected with the conductive posts 312 of the die 300. Insome embodiments, the signal originated from the die 300 may betransmitted to the horn antenna 1300 through the first redistributioncircuit patterns 504 a. Therefore, the first redistribution circuitpatterns 504 a may be referred to as a feed line in some embodiments. Itshould be noted that although FIG. 14E illustrated that the die 300 isplaced in a face up manner, the disclosure is not limited thereto. Insome alternative embodiments, the die 300 may be placed in a face downmanner. Under this scenario, the first redistribution circuit patterns104 a (bottom wall of the horn antenna 1300) may extend over the activesurface 300 a of the die 300 to electrically connect the horn antenna1300 and the die 300.

In some embodiments, a shape of the top wall (the first redistributioncircuit patterns 504 a) may be identical to a shape of the bottom wall(the first redistribution circuit patterns 104 a). In some embodiments,the top wall (the first redistribution circuit patterns 504 a) may beparallel to the bottom wall (the first redistribution circuit patterns104 a). For example, an extending direction of the top wall and anextending direction of the bottom wall may both parallel to the activesurface 300 a of the die. Moreover, as illustrated in FIG. 13E and FIG.14E, the location of the top wall (the first redistribution circuitpatterns 504 a) corresponds to the location of the bottom wall (thefirst redistribution circuit patterns 104 a). For example, a verticalprojection of the first redistribution circuit patterns 504 a along adirection perpendicular to the active surface 300 a of the die 300 maycompletely overlap with the first redistribution circuit patterns 104 a.

As illustrated in FIG. 12, the sidewalls (the conductive structures 202)of the horn antenna 1300 are not parallel to each other to form ahorn-shaped enclosure with the paralleled top and bottom walls. Forexample, the first redistribution circuit patterns 504 a (the top wallof the horn antenna 1300) may include a first portion 504 a 1 and asecond portion 504 a 2. The first portion 504 a 1 is closer to the die300 than the second portion 504 a 2. In some embodiments, a width W504 a1 of the first portion 504 a 1 is smaller than a width W504 a 2 of thesecond portion 504 a 2. In some embodiments, the first portion 504 a 1may have a uniform width W540 a 1 while the second portion 504 a 2 mayhave a non-uniform width W504 a 2. As mentioned above, the shape of thefirst redistribution circuit patterns 504 a and the shape of the firstredistribution circuit patterns 104 a may be identical. As such, it isunderstood that the width relationship of the first redistributioncircuit patterns 504 a presented above may also apply to the firstredistribution circuit patterns 104 a.

Referring to FIG. 13F and FIG. 14F, a plurality of openings OP is formedin the outermost dielectric layer 502 of the redistribution structure500. In some embodiments, the openings OP are formed by a laser drillingprocess, a mechanical drilling process, a photolithography process andan etching process, or other suitable processes. As illustrated in FIG.13F and FIG. 14F, the openings OP expose the outermost secondredistribution circuit patterns 504 b of the redistribution structure500. Subsequently, a plurality of conductive terminals 900 is formedover the redistribution structure 500 opposite to the die 300. In someembodiments, the conductive terminals 900 extend into the openings OP toelectrically connect with the outermost second redistribution circuitpattern 504 b. In some embodiments, a plurality of UBM patterns (notshown) may be formed on the outermost dielectric layer 502 and in theopenings OP. The conductive terminals 900 may be disposed over the UBMpatterns. In some embodiments, the conductive terminals 900 are attachedto the UBM patterns through a solder flux. In some embodiments, theconductive terminals 900 are, for example, solder balls. In someembodiments, the conductive terminals 900 may be disposed on theredistribution structure 500 through a ball placement process and/or areflowing process.

Referring to FIG. 13G and FIG. 14G, the structure illustrated in FIG.13F and FIG. 14F are flipped upside down. The carrier C1 and thede-bonding layer DB are removed to obtain the InFO package 20. In someembodiments, the de-bonding layer DB (e.g., the LTHC release layer) maybe irradiated by an UV laser such that the carrier C1 and the de-bondinglayer DB may be peeled off from the dielectric layer 102 of theredistribution structure 100. However, the de-bonding process is notlimited thereto. Other suitable de-carrier methods may be used in somealternative embodiments.

FIG. 15 is a schematic top view illustrating an InFO package 30 inaccordance with some alternative embodiments of the disclosure.Referring to FIG. 15, the manufacturing process of the InFO package 30will be described below in conjunction with FIG. 16A to FIG. 16I.

FIG. 16A to FIG. 16I are schematic cross-sectional views illustrating amanufacturing process of the InFO package in FIG. 15 along line A-A′.Referring to FIG. 16A to FIG. 16E, the steps illustrated in FIG. 16A toFIG. 16E are similar to the steps shown in FIG. 3A to FIG. 3E, sosimilar elements are denoted by the same reference numeral and thedetailed descriptions thereof are omitted herein. Referring to FIG. 16F,a redistribution structure 500 is formed over the conductive structures200, the die 300, and the encapsulant 402. The method of forming theredistribution structure 500 in FIG. 16F may be similar to that of theredistribution structure 500 in FIG. 3F, so the detailed descriptionsthereof are omitted herein. In some embodiments, the redistributionstructure 500 includes a plurality of dielectric layers 502, a pluralityof redistribution circuit patterns 504, and a plurality of conductivevias 506. In some embodiments, the redistribution circuit patterns 504are sandwiched between two adjacent dielectric layers 502. On the otherhand, the conductive vias 506 are embedded in the dielectric layer 502.In some embodiments, the redistribution circuit patterns 504 areelectrically connected to the conductive structures 200 and the die 300through the conductive vias 506. As illustrated in FIG. 16F, theredistribution circuit patterns 504 are covered by the dielectric layer502 and are not revealed. In some embodiments, a material of thedielectric layer 502 includes polyimide, epoxy resin, acrylic resin,phenol resin, BCB, PBO, or any other suitable polymer-based dielectricmaterial. On the other hand, a material of the redistribution circuitpatterns 504 and the conductive vias 506 includes aluminum, titanium,copper, nickel, tungsten, and/or alloys thereof.

Referring to FIG. 16G, a plurality of dielectric lens 1400 are placedover the redistribution structure 500. In some embodiments, thedielectric lenses 1400 are disposed on the redistribution structure 500through a pick-and-place process. In some embodiments, a material of thedielectric lenses 1400 has a low Df and/or a Dk. Depending on thefrequency range of high-speed applications, suitable material may beselected based on the required electrical properties of the subsequentlyformed InFO package 30. For example, the material of the dielectriclenses 1400 may include polymer, the like, or a combination thereof. Insome embodiments, a top surface of the each dielectric lens 1400 has acurvature to function as a lens. In some embodiments, the dielectriclenses 1400 are placed directly above the redistribution circuitpatterns 504 that is electrically connected to the die 300.

In some embodiments, the dielectric lenses 1400 may be referred to asdielectric antennas. For example, the signal originated from the die 300may be transmitted to the redistribution circuit patterns 504 connectedto the die 300. Then, the dielectric lenses 1400 placed directly abovethe redistribution circuit patterns 504 may be configured to receive thesignal emitted from the redistribution circuit patterns 504. Since thedielectric lenses 1400 have curved top surfaces, the signal emitted fromthe redistribution circuit patterns 504 may be focused by the lensnature of the dielectric lenses 1400. As such, the signal strength maybe ensured, thereby enhancing the signal transmission reliability.

Referring to FIG. 16H, an insulating layer 1500 is formed on theredistribution structure 500. In some embodiments, a material of theinsulating layer 1500 has a low Df and/or a low Dk. For example, theinsulating layer 1500 may include polymer, the like, or a combinationthereof. However, the disclosure is not limited thereto. In somealternative embodiments, the material of the insulating layer 1500 maynot have a low Df and/or a low Dk. For example, the insulating layer1500 may include a molding compound, a molding underfill, a resin (suchas epoxy), or the like. In some embodiments, the insulating layer 1500may be formed by a molding process. For example, the insulating layer500 may be formed by the following steps. First, a mold chase (notshown) having a release film (not shown) attached thereon may beprovided over the redistribution structure 500 and the dielectric lenses1400. The release film may be directly in contact with the dielectriclenses 1400. Then, an insulating material (not shown) may be filled intothe gap between the release film and the redistribution structure 500.Thereafter, the insulating material is cured to form the insulatinglayer 1500. Subsequently, the release film is detached from theinsulating layer 1500 and the dielectric lenses 1400.

As illustrated in FIG. 16H, the insulating layer 1500 laterally wrapsaround the dielectric lenses 1400. In some embodiments, the dielectriclenses 1400 protrude from a top surface 1500 a of the insulating layer1500. For example, the curved top surfaces of the dielectric lenses 1400may protrude above the top surface 1500 a of the insulating layer 1500.In other words, the dielectric lenses 1400 are partially embedded in theinsulating layer 1500.

Referring to FIG. 16I, the carrier C1 and the de-bonding layer DB areremoved. In some embodiments, the de-bonding layer DB (e.g., the LTHCrelease layer) may be irradiated by an UV laser such that the carrier C1and the de-bonding layer DB may be peeled off from the dielectric layer102 of the redistribution structure 100. However, the de-bonding processis not limited thereto. Other suitable de-carrier methods may be used insome alternative embodiments. Thereafter, a plurality of openings OP isformed in the outermost dielectric layer 102 of the redistributionstructure 100. In some embodiments, the openings OP are formed by alaser drilling process, a mechanical drilling process, aphotolithography process and an etching process, or other suitableprocesses. As illustrated in FIG. 16I, the openings OP expose theoutermost redistribution circuit patterns 104 of the redistributionstructure 100. Subsequently, a plurality of conductive terminals 900 isformed over the redistribution structure 100 opposite to the die 300 toobtain the InFO package 30. In some embodiments, the conductiveterminals 900 extend into the openings OP to electrically connect withthe outermost redistribution circuit pattern 104. In some embodiments, aplurality of UBM patterns (not shown) may be formed on the outermostdielectric layer 102 and in the openings OP. The conductive terminals900 may be disposed over the UBM patterns. In some embodiments, theconductive terminals 900 are attached to the UBM patterns through asolder flux. In some embodiments, the conductive terminals 900 are, forexample, solder balls. In some embodiments, the conductive terminals 900may be disposed on the redistribution structure 100 through a ballplacement process and/or a reflowing process.

In accordance with some embodiments of the disclosure, an integratedfan-out (InFO) package includes a first redistribution structure, aplurality of dies, a plurality of first conductive structures, anencapsulant, a second redistribution structure, an insulating layer, aplurality of second conductive structures, an antenna confinementstructure, and a slot antenna. The dies and the first conductivestructures are disposed on the first redistribution structure. The firstconductive structures surround the die. The encapsulant encapsulates thedies and the first conductive structures. The second redistributionstructure is disposed on the dies, the first conductive structures, andthe encapsulant. The insulating layer is over the second redistributionstructure. The second conductive structures and the antenna confinementstructure are embedded in the insulating layer. The slot antenna isdisposed on the insulating layer.

In accordance with some alternative embodiments of the disclosure, anintegrated fan-out (InFO) package includes a first redistributionstructure, a die, an encapsulant, a second redistribution structure, anda horn antenna. The die is disposed on the first redistributionstructure. The encapsulant encapsulates the die. The secondredistribution structure is disposed on the die and the encapsulant. Thehorn antenna is adjacent to the die. The horn antenna includes a topwall, a bottom wall opposite to the top wall, and a pair of sidewallsconnecting the top wall and the bottom wall. The bottom wall is embeddedin the first redistribution structure, the top wall is embedded in thesecond redistribution structure, and the pair of sidewalls penetratesthrough the encapsulant. One of the top wall and the bottom wall extendsabove an active surface of the die to electrically connect the hornantenna and the die.

In accordance with some alternative embodiments of the disclosure, anintegrated fan-out (InFO) package includes a first redistributionstructure, a die, a plurality of conductive structures, an encapsulant,a second redistribution structure, an insulating layer, and a pluralityof dielectric lenses. The die is disposed on the first redistributionstructure. The conductive structures are disposed on the firstredistribution structure and surround the die. The encapsulantencapsulates the die and the conductive structures. The secondredistribution structure is disposed on the die, the encapsulant, andthe conductive structures. The insulating layer is disposed on thesecond redistribution structure. The dielectric lenses are embedded inthe insulating layer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. An integrated fan-out (InFO) package, comprising:a plurality of dies; an encapsulant laterally encapsulating theplurality of dies; an insulating layer disposed over the plurality ofdies and the encapsulant; a redistribution structure sandwiched betweenthe insulating layer and the plurality of dies; a plurality ofconductive structures and an antenna confinement structure embedded inthe insulating layer; and a slot antenna disposed on the insulatinglayer.
 2. The InFO package according to claim 1, wherein the antennaconfinement structure comprises a ring structure surrounding theplurality of conductive structures.
 3. The InFO package according toclaim 1, wherein the antenna confinement structure comprises a pluralityof antenna confinement patterns separated from each other, wherein theplurality of antenna confinement patterns surrounds the plurality ofconductive structures.
 4. The InFO package according to claim 1, whereinthe antenna confinement structure is electrically grounded.
 5. The InFOpackage according to claim 1, further comprising a protection layerdisposed on the insulating layer, wherein the slot antenna is embeddedin the protection layer.
 6. The InFO package according to claim 1,wherein the redistribution structure comprises at least one dielectriclayer, and a material of the at least one dielectric layer is differentfrom a material of the insulating layer.
 7. The InFO package accordingto claim 1, wherein the redistribution structure comprises at least onedielectric layer, and a material of the at least one dielectric layer isthe same as a material of the insulating layer.
 8. The InFO packageaccording to claim 1, further comprising: a first auxiliary insulatinglayer disposed over the slot antenna; a plurality of first conductivepatterns embedded in the first auxiliary insulating layer; a secondauxiliary insulating layer disposed on the first auxiliary insulatinglayer; and a plurality of second conductive patterns disposed on thesecond auxiliary insulating layer, wherein the plurality of firstconductive patterns and the plurality of second conductive patterns arearranged periodically to form metamaterial lenses.
 9. The InFO packageaccording to claim 1, wherein the redistribution structure is furthersandwiched between the insulating layer and the encapsulant.
 10. TheInFO package according to claim 1, wherein a height of the plurality ofconductive structures ranges between 30 μm and 50 μm.
 11. An integratedfan-out (InFO) package, comprising: a first redistribution structure; asecond redistribution structure disposed over the first redistributionstructure; a die and an encapsulant sandwiched between the firstredistribution structure and the second redistribution structure,wherein the encapsulant laterally encapsulates the die; and a hornantenna electrically connected to the die, wherein the horn antenna isembedded in the first redistribution structure, the secondredistribution structure, and the encapsulant.
 12. The InFO packageaccording to claim 11, wherein the horn antenna comprises a top wall, abottom wall opposite to the top wall, and a pair of sidewalls connectingthe top wall and the bottom wall, the bottom wall is embedded in thefirst redistribution structure, the top wall is embedded in the secondredistribution structure, and the pair of sidewalls is embedded in theencapsulant.
 13. The InFO package according to claim 12, wherein the topwall and the bottom wall are parallel to each other.
 14. The InFOpackage according to claim 12, wherein the sidewalls are not parallel toeach other.
 15. The InFO package according to claim 12, wherein a shapeof the top wall is identical to a shape of the bottom wall.
 16. The InFOpackage according to claim 12, wherein each of the top wall comprises afirst portion and a second portion, the first portion is closer to thedie than the second portion, and a width of the first portion is smallerthan a width of the second portion.
 17. An integrated fan-out (InFO)package, comprising: a die having an active surface; an encapsulantlaterally encapsulating the die; a redistribution structure disposed onthe active surface of the die and the encapsulant; an insulating layerdisposed on the redistribution structure; and a plurality of dielectriclenses embedded in the insulating layer.
 18. The InFO package accordingto claim 17, wherein each of the plurality of dielectric lenses ispartially embedded in the insulating layer.
 19. The InFO packageaccording to claim 17, wherein the plurality of dielectric lensesprotrudes from a top surface of the insulating layer.
 20. The InFOpackage according to claim 17, wherein the redistribution structurecomprises a plurality of redistribution circuit patterns electricallyconnected to the die, and the plurality of dielectric lenses is placeddirectly above the plurality of redistribution circuit patterns.